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Please use this identifier to cite or link to this item: http://www.lib.ncsu.edu/resolver/1840.16/6977

Title: Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.
Authors: Melamed, Samson
Advisors: William Davis, Chair
Paul Franzon, Member
Michael Steer, Member
Donald Bitzer, Member
Issue Date: 29-Apr-2011
Degree: Doctor of Philosophy
Discipline: Electrical Engineering
URI: http://www.lib.ncsu.edu/resolver/1840.16/6977
Appears in Collections:Dissertations

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