NCSU Institutional Repository >
NC State Theses and Dissertations >
Dissertations >

Please use this identifier to cite or link to this item:

Title: Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.
Authors: Melamed, Samson
Advisors: William Davis, Chair
Paul Franzon, Member
Michael Steer, Member
Donald Bitzer, Member
Issue Date: 29-Apr-2011
Degree: Doctor of Philosophy
Discipline: Electrical Engineering
Appears in Collections:Dissertations

Files in This Item:

File Description SizeFormat
etd.pdf19 MBAdobe PDFView/Open

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.