Browsing by Author "Dr. Gregory N. Parsons, Chair"

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    Reactions for Yttrium Silicate High-k Dielectrics
    (2000-07-28) Chambers, James Joseph; Dr. Gregory N. Parsons, Chair; Dr. David F. Ollis, Co-Chair; Dr. H. Henry Lamb, Member; Dr. Mehmet C. Ozturk, Member
    The continued scaling of metal-oxide-semiconductor-field-effect-transistors (MOSFETs) will require replacing the silicon dioxide gate dielectric with an alternate high dielectric constant (high-k) material. We have exploited the high reactivity of yttrium with both silicon and oxygen to form yttrium silicate high-k dielectrics. Yttrium silicate films with composition of (Y)₁₋[subscript x] and x = 0.32 to 0.87 are formed by oxidizing yttrium on silicon where yttrium reacts concurrently with silicon and oxygen. The competition between silicon and oxygen for yttrium is studied using X-ray photoelectron spectroscopy (XPS) and medium energy ion scattering (MEIS). The initial yttrium thickness mediates the silicon consumption, and a critical thickness (~40-80 Å) exists below which silicon is consumed to form yttrium silicate and above which Y forms without silicon incorporation. Engineered interfaces modify the silicon consumption, and a nitrided silicon interface results in film with composition close to Y. The silicon consumption also depends on the oxidation temperature, and oxidation at higher temperature generally results in greater silicon incorporation with an activation energy of 0.3-0.5 eV. Yttrium silicate films (~40 Å) formed by oxidation of yttrium on silicon have an amorphous microstructure and an equivalent silicon dioxide thickness of ~12 Å with leakage current . Yttrium silicate formation on silicon is also demonstrated using plasma oxidation of yttrium on silicon, reactive sputtering of yttrium and annealing/oxidation of yttrium on thermal SiO. The interface reactions described here for yttrium are expected to be active during both physical and chemical vapor deposition of other high-k dielectrics containing Hf, Zr and La.
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    Surface reactions during plasma enhanced chemical vapor deposition of silicon and silicon based dielectrics
    (2001-11-06) Gupta, Atul; Dr. Gregory N. Parsons, Chair; Dr. David F. Ollis, Co-Chair; Dr. H. Henry Lamb, Member; Dr. Phillip E. Russell, Member
    Theoretical ab-initio calculations (including both the Configuration Interaction and Density Functional approaches) are used to describe some of the critical surface reactions during plasma enhanced chemical vapor deposition of amorphous and micro-crystalline silicon films. The energetics as well as the reaction mechanism are calculated for the abstraction of surface hydrogen by incident silyl and hydrogen radicals. Another important reaction involving the insertion of these radicals (silyl and hydrogen) into strained Si-Si bonds on the surface is also evaluated. Experiments involve surface topology evolution studies of plasma deposited a-Si:H films using atomic force microscopy (AFM) as well as structural and electrical characterization of silicon dioxide films using several techniques including infrared spectroscopy, ellipsometry, and current-voltage measurements. A predictive kinetic model to describe the growth of silicon films from a predominantly silyl radical flux is developed to explain experimental observations regarding the properties of plasma deposited amorphous silicon films. The model explains diffusion length enhancements under certain processing conditions as well as lays a foundation for understanding the Si-Si network formation during the deposition of a-Si films.