Browsing by Author "William Davis, Co-Chair"
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- 3D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model.(2018-04-20) Park, Jong Beom; Paul Franzon, Co-Chair; William Davis, Co-Chair; James Tuck, Member; Hans Hallen, Member
- An Evolutionary Approach to Producing Optimal Electronic Design Automation Tool Settings.(2021-05-10) Huggins, Billy; Paul Franzon, Co-Chair; William Davis, Co-Chair; Dror Baron, Member; Min Chi, Graduate School Representative; Aydin Aysu, Member
- Machine Learning for Design Rule Checking,Multilayer CMP Hotspot Detection, and PPA Modeling, with Transfer Learning and Synthetic Training.(2021-05-12) Francisco Fernandez, Luis Sandry; Paul Franzon, Co-Chair; William Davis, Co-Chair; Franc Brglez, Member; Aydin Aysu, Member
- Power Contributor Modeling for Estimating Leakage Power Dissipated in a Design.(2017-10-10) Gupta, Barkha; William Davis, Co-Chair; Paul Franzon, Co-Chair; Huiyang Zhou, Member; Robert Evans, Member
- System and Gate-level Dynamic Electrothermal Simulation of Three Dimensional Integrated Circuits.(2013-06-19) Priyadarshi, Shivam; Paul Franzon, Co-Chair; William Davis, Co-Chair; Michael Steer, Member; Sharon Lubkin, Member
- Three-Dimensional Integration of Heterogeneous Multi-Core Processors.(2016-05-20) Widialaksono, Randy Hari; William Davis, Co-Chair; Paul Franzon, Co-Chair; Agnes Szanto, Member; Eric Rotenberg, Member
