Process Development for an Ultra High Density Chip-on-Chip Power Module.

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Title: Process Development for an Ultra High Density Chip-on-Chip Power Module.
Author: Yang, Mingyu
Advisors: Douglas Hopkins, Chair
Subhashish Bhattacharya, Member
Wensong Yu, Member
Date: 2014-12-19
Degree: Master of Science
Discipline: Electrical Engineering
URI: http://www.lib.ncsu.edu/resolver/1840.16/10118


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