Design, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits.
| Title: | Design, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits. |
| Author: | Charles, Gary |
| Advisors: | Paul Franzon, Chair Winser Alexander, Member William Davis, Member Amassa Fauntleroy, Member |
| Date: | 2012-08-17 |
| Degree: | Doctor of Philosophy |
| Discipline: | Electrical Engineering |
| URI: | http://www.lib.ncsu.edu/resolver/1840.16/10302 |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
| etd.pdf | 2.000Mb |
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