Design, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits.

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Title: Design, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits.
Author: Charles, Gary
Advisors: Paul Franzon, Chair
Winser Alexander, Member
William Davis, Member
Amassa Fauntleroy, Member
Date: 2012-08-17
Degree: Doctor of Philosophy
Discipline: Electrical Engineering
URI: http://www.lib.ncsu.edu/resolver/1840.16/10302


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