The Adhesion of Paperboard to the Gypsum Core of Wallboard: An Investigation of Adhesive Bond Quality in Response to Paper Production Variables and Relative Humidity.

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Title: The Adhesion of Paperboard to the Gypsum Core of Wallboard: An Investigation of Adhesive Bond Quality in Response to Paper Production Variables and Relative Humidity.
Author: Tomasiewicz, Ryan
Advisors: Dr. John A. Heitmann Jr., Committee Member
Dr. Joel J. Pawlak, Committee Member
Dr. Martin A. Hubbe, Committee Chair
Abstract: The research investigated the interactions between paperboard and the gypsum core during the manufacturing process of gypsum wallboard. The goal of this research was to understand the paper properties that can affect the quality of the adhesive bond under simulated test conditions. The categories of paper properties tested include strength properties, surface properties, and paper additives. This research showed that the current test methods in use did not provide enough sensitive and reproducibility data to gain crucial insight into the paper/core adhesive interaction. A new evaluation method must be secured. However, with the results obtained, it was believed that the three types of failure could be described. First, the adhesive bond may fail resulting in a clean peel during bond quality testing. Second, the paper bond network may fail resulting in complete paper coverage of the gypsum core. Third, a mixed failure of adhesive and paper bond resulted in incomplete and varied paper coverage of the gypsum core.
Date: 2004-07-01
Degree: MS
Discipline: Wood and Paper Science
URI: http://www.lib.ncsu.edu/resolver/1840.16/1679


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