Fabrication and Characterization of Electrical Contacts for Charge Transport Study in Molecular Electronics.

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dc.contributor.advisor Veena Misra, Committee Member en_US
dc.contributor.advisor Orlin D. Velev, Committee Member en_US
dc.contributor.advisor Gregory N. Parsons, Committee Chair en_US
dc.contributor.advisor Christine S. Grant, Committee Member en_US
dc.contributor.author Chu, Changwoong en_US
dc.date.accessioned 2010-04-02T19:08:26Z
dc.date.available 2010-04-02T19:08:26Z
dc.date.issued 2006-09-29 en_US
dc.identifier.other etd-09202005-171917 en_US
dc.identifier.uri http://www.lib.ncsu.edu/resolver/1840.16/5132
dc.description.abstract Nanoscale imprint lithography (NIL) is investigated in the view point of the ability to form nanoscale feature. NIL at room temperature is proposed and demonstrated on thermoplastic substrate that has a restriction of heating. Anisotropic oxygen-based plasma etch performance is evaluated to remove the residual resist at the bottom of impressed pattern and to achieve the thinner patterns with various etching molecules. The patterning fidelity in nano-imprint lithography including the ability of polymer deformation is studied, and based on the results a mechanism for the polymeric behavior of imprinted resist is discussed. A procedure using geometrical shadowing in common metal-evaporation tools to form nanoscale metal electrodes with controlled width-to-pitch ratios is demonstrated and characterized for feature sizes near 50 nm. Successive formation of metallic bridge with the metallic nanoparticle for the conductance study and the electrical characterization are described. From the results of electrical conduction, we estimate the contact area (~20.1 nm2) and the number of molecules between nanoparticle and surface-bound molecules, and then calculate the resistances of single molecules, contact resistance, the tunneling probabilities in contacts. The electrical characterization of the conjugated molecules has been accomplished using the same nanoscale test-bed in terms of surface bound head groups. As a new approach for the interconnecting elementary molecular devices, Au nanoparticle dimer bridged by conjugated molecule is assembled on the nanoscale electrode gap. Oligo Phenylacetylene-bridged gold nanoparticle dimer was prepared for the demonstration. Resistance measured at low bias regime is 2.2 ± 0.64 GΩ at room temperature, which is comparable with the single molecule conduction. The selective adsorption of SAM on Au plates by means of electron supply is proposed to develop the pliable manipulation of self-assembling molecular elementary devices. The method is applied to the two metal patterns, which is an electrical test-bed for the molecular resistors. The electrical characterization is in good agreement with the selective formation of molecular layer on metal. en_US
dc.rights I hereby certify that, if appropriate, I have obtained and attached hereto a written permission statement from the owner(s) of each third party copyrighted matter to be included in my thesis, dissertation, or project report, allowing distribution as specified below. I certify that the version I submitted is the same as that approved by my advisory committee. I hereby grant to NC State University or its agents the non-exclusive license to archive and make accessible, under the conditions specified below, my thesis, dissertation, or project report in whole or in part in all forms of media, now or hereafter known. I retain all other ownership rights to the copyright of the thesis, dissertation or project report. I also retain the right to use in future works (such as articles or books) all or part of this thesis, dissertation, or project report. en_US
dc.subject self-assembly monolayer en_US
dc.subject tunneling en_US
dc.subject molecular electronics en_US
dc.subject nanofabrication en_US
dc.title Fabrication and Characterization of Electrical Contacts for Charge Transport Study in Molecular Electronics. en_US
dc.degree.name PhD en_US
dc.degree.level dissertation en_US
dc.degree.discipline Chemical Engineering en_US


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