Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.

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Title: Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.
Author: Melamed, Samson
Advisors: William Davis, Chair
Paul Franzon, Member
Michael Steer, Member
Donald Bitzer, Member
Date: 2011-04-29
Degree: Doctor of Philosophy
Discipline: Electrical Engineering
URI: http://www.lib.ncsu.edu/resolver/1840.16/6977


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