Packaging and Integration of Three Dimensional Microsensors.

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Title: Packaging and Integration of Three Dimensional Microsensors.
Author: Gadfort, Peter
Advisors: Paul Franzon, Chair
Mehmet Ozturk, Member
Jon-Paul Maria, Member
Michael Steer, Member
Date: 2013-12-16
Degree: Doctor of Philosophy
Discipline: Electrical Engineering
URI: http://www.lib.ncsu.edu/resolver/1840.16/9196


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