Buried solder bumps for AC-coupled microelectronic interconnects

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Title: Buried solder bumps for AC-coupled microelectronic interconnects
Date: 2005
Citation: Franzon, P. D., Mick, S. E., & Wilson, J. M. (2005). Buried solder bumps for AC-coupled microelectronic interconnects. U.S. Patent No. 6,927,490. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1023


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