Three-zone rapid thermal processing system utilizing wafer edge heating means
| dc.date.accessioned | 2008-07-28T20:40:28Z | |
| dc.date.available | 2008-07-28T20:40:28Z | |
| dc.date.issued | 1995 | |
| dc.identifier.citation | Hauser, J., Sorrell, F., & Wortman, J. (1995). Three-zone rapid thermal processing system utilizing wafer edge heating means. U.S. Patent No. 5,418,885. Washington, DC: U.S. Patent and Trademark Office. | |
| dc.identifier.uri | http://www.lib.ncsu.edu/resolver/1840.2/1237 | |
| dc.format.extent | 90104 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | |
| dc.title | Three-zone rapid thermal processing system utilizing wafer edge heating means | |
| dc.type | Patent |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
| US_5418885_A_I.pdf | 87.99Kb |
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