Porous siliconformation and etching process for use in silicon micromachining

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Title: Porous siliconformation and etching process for use in silicon micromachining
Date: 1991
Citation: Guilinger, T. R., Jones, H. D. T., Kelly, M. J., Martin, S. B., Stevenson, J. O., & Tsao, S. S. (1991). Porous siliconformation and etching process for use in silicon micromachining. U.S. Patent No. 4,995,954. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1279


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