Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers

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Title: Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
Date: 2004
Citation: Basceri, C., Visokay, M., Graettinger, T. M., & Cummings, S. D. (2004). Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers. U.S. Patent No. 6,812,112. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1316


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