Top surface roughness reduction of high-k dielectric materials using plasma based processes

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Title: Top surface roughness reduction of high-k dielectric materials using plasma based processes
Date: 2006
Citation: Quevedo-Lopez, M. A., Chambers, J. J., Colombo, L., & Visokay, M. R. (2006). Top surface roughness reduction of high-k dielectric materials using plasma based processes. U.S. Patent No. 7,115,530. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1398


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