Method for enhanced inductive coupling to plasmas with reduced sputter contamination

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Title: Method for enhanced inductive coupling to plasmas with reduced sputter contamination
Date: 1997
Citation: Cuomo, J. J., Guarnieri, C. R., & Hopwood, J. A. (1997). Method for enhanced inductive coupling to plasmas with reduced sputter contamination. U.S. Patent No. 5,622,635. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1409


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