Use of CO.sub.2 -soluble materials in making molds

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Title: Use of CO.sub.2 -soluble materials in making molds
Date: 1999
Citation: DeSimone, J. M., Gulari, E., & Manke, C. (1999). Use of CO.sub.2 -soluble materials in making molds. U.S. Patent No. 5,860,467. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1560


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