High performance integrated circuit chip package

Show full item record

Title: High performance integrated circuit chip package
Date: 1994
Citation: Turlik, I., Reisman, A., Nayak, D., Hwang, L., Dishon, G., Jacobs, S., Darveaux, R., Poley, & Neil, M. (1994). High performance integrated circuit chip package. U.S. Patent No. 5,325,265. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1591


Files in this item

Files Size Format View
US_5325265_A_I.pdf 195.0Kb PDF View/Open

This item appears in the following Collection(s)

Show full item record