Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip
No Thumbnail Available
Date
2007
Authors
Advisors
Journal Title
Series/Report No.
Journal ISSN
Volume Title
Publisher
Abstract
Description
Keywords
Citation
Cross, J. S., Tsukada, M., Horii, Y., Gruverman, A., & Kingon, A. (2007). Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip. U.S. Patent No. 7,239,026. Washington, DC: U.S. Patent and Trademark Office.