Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip

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Title: Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip
Date: 2007
Citation: Cross, J. S., Tsukada, M., Horii, Y., Gruverman, A., & Kingon, A. (2007). Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip. U.S. Patent No. 7,239,026. Washington, DC: U.S. Patent and Trademark Office.
URI: http://www.lib.ncsu.edu/resolver/1840.2/1774


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