Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip

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2007

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Cross, J. S., Tsukada, M., Horii, Y., Gruverman, A., & Kingon, A. (2007). Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip. U.S. Patent No. 7,239,026. Washington, DC: U.S. Patent and Trademark Office.

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