Low-temperature (<450 degrees C), plasma-assisted deposition of poly-Si thin films on SiO2 and glass through interface engineering (vol 15, pg 1035, 1997)
Title: | Low-temperature (<450 degrees C), plasma-assisted deposition of poly-Si thin films on SiO2 and glass through interface engineering (vol 15, pg 1035, 1997) |
Date: | 1998 |
Citation: | Wolfe, D. M., Wang, F., Habermehl, S., Lucovsky, G. (1998). Low-temperature (<450 degrees C), plasma-assisted deposition of poly-Si thin films on SiO2 and glass through interface engineering (vol 15, pg 1035, 1997) Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 16(1), 207. |
URI: | http://www.lib.ncsu.edu/resolver/1840.2/282 |
Files in this item
Files | Size | Format | View |
---|---|---|---|
lucovsky_1998_journal_vacuum_science_tech_207.pdf | 33.38Kb |
View/ |