Thermal Stresses Due to Uniform Heat Flow in Thick Plates with a Circular Hole

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Title: Thermal Stresses Due to Uniform Heat Flow in Thick Plates with a Circular Hole
Author: C. W. Lee
Publisher: IASMiRT
Date: 1973-09-10
Series/Report No.: L - Heat Conduction and Thermal Stress Analysis; Inelastic Structural Behaviour
L2 - Miscellaneous Thermal Stress Problems
SMiRT 2 - Berlin, Germany. September 10-14, 1973
URI: http://www.lib.ncsu.edu/resolver/1840.20/28770


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