3-D Prismatic Packaging Methodologies for Wide Band Gap Power electronics Modules
Title: | 3-D Prismatic Packaging Methodologies for Wide Band Gap Power electronics Modules |
Author: | Ke, Haotao |
Advisors: | Douglas Hopkins, Chair Subhashish Bhattacharya, Member B. Baliga, Member Ola Lars Harrysson, Member |
Date: | 2017-09-15 |
Degree: | Doctor of Philosophy |
Discipline: | Electrical Engineering |
URI: | http://www.lib.ncsu.edu/resolver/1840.20/34735 |
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