3-D Prismatic Packaging Methodologies for Wide Band Gap Power electronics Modules

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Title: 3-D Prismatic Packaging Methodologies for Wide Band Gap Power electronics Modules
Author: Ke, Haotao
Advisors: Douglas Hopkins, Chair
Subhashish Bhattacharya, Member
B. Baliga, Member
Ola Lars Harrysson, Member
Date: 2017-09-15
Degree: Doctor of Philosophy
Discipline: Electrical Engineering
URI: http://www.lib.ncsu.edu/resolver/1840.20/34735


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