3-D Prismatic Packaging Methodologies for Wide Band Gap Power electronics Modules
| Title: | 3-D Prismatic Packaging Methodologies for Wide Band Gap Power electronics Modules |
| Author: | Ke, Haotao |
| Advisors: | Douglas Hopkins, Chair Subhashish Bhattacharya, Member B. Baliga, Member Ola Lars Harrysson, Member |
| Date: | 2017-09-15 |
| Degree: | Doctor of Philosophy |
| Discipline: | Electrical Engineering |
| URI: | http://www.lib.ncsu.edu/resolver/1840.20/34735 |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
| etd.pdf | 3.731Mb |
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