Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.

Simple item page
dc.contributor.advisorWilliam Davis, Chairen_US
dc.contributor.advisorPaul Franzon, Memberen_US
dc.contributor.advisorMichael Steer, Memberen_US
dc.contributor.advisorDonald Bitzer, Memberen_US
dc.contributor.authorMelamed, Samsonen_US
dc.date.accepted2011-06-29en_US
dc.date.accessioned2011-07-01T07:00:16Z
dc.date.available2011-07-01T07:00:16Z
dc.date.defense2011-04-29en_US
dc.date.issued2011-04-29en_US
dc.date.released2011-07-01en_US
dc.date.reviewed2011-05-06en_US
dc.date.submitted2011-04-29en_US
dc.degree.disciplineElectrical Engineeringen_US
dc.degree.leveldissertationen_US
dc.degree.nameDoctor of Philosophyen_US
dc.identifier.otherdeg807en_US
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.16/6977
dc.rightsen_US
dc.titleJunction-Level Thermal Analysis of Three Dimensional Integrated Circuits.en_US

Files

Original bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
etd.pdf
Size:
18.56 MB
Format:
Adobe Portable Document Format
Download

Collections

Dissertations