Three-zone rapid thermal processing system utilizing wafer edge heating means

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dc.date.accessioned2008-07-28T20:40:28Z
dc.date.available2008-07-28T20:40:28Z
dc.date.issued1995
dc.format.extent90104 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.citationHauser, J., Sorrell, F., & Wortman, J. (1995). Three-zone rapid thermal processing system utilizing wafer edge heating means. U.S. Patent No. 5,418,885. Washington, DC: U.S. Patent and Trademark Office.
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.2/1237
dc.language.isoen
dc.titleThree-zone rapid thermal processing system utilizing wafer edge heating means
dc.typePatent

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