Quantifying the Benefits of Improved Rolling of Chip Seals.
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Date
2009-04-23
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Abstract
This dissertation presents an improvement in the rolling protocol for chip seals
based on an evaluation of aggregate retention performance and aggregate embedment
depth. The flip-over test (FOT), Vialit test, modified sand circle test, digital image
processing technique, and the third-scale Model Mobile Loading Simulator (MMLS3) are
employed to evaluate the effects of the various rolling parameters and to measure chip
seal performance. The samples used to evaluate the chip seal rolling protocol were
obtained directly from field construction. In order to determine the optimal rolling
protocol, the effects of roller type, number of coverages, coverage distribution on the
sublayers of a multiple chip seal (i.e., the split seal and triple seal), and rolling pattern are
evaluated using the results of aggregate retention performance tests, the modified sand
circle method, and the digital image process. It is found that two types of roller, the
pneumatic tire roller and the combination roller, are recommended as the optimal rollers
for the chip seal. In addition, it is found that the optimal number of coverages for the chip
seal, as determined from measurements of the aggregate, is three coverages. Moreover,
the performance of the triple seal without coverage at the bottom layer does not affect the
aggregate retention performance, although the split seal does require coverage at the
bottom layer. Finally, it is found that the rolling pattern is strongly related to a delayed
rolling time between the aggregate spreader and the initial rolling time. Therefore, it was
recommended that two pneumatic tire rollers applied initial one coverage with optimal
delayed rolling time (between 2 min. and 4 min.) to entire lane width, and then the
combination roller applied two additional coverages. Further, it is confirmed that the
delayed rolling time is related to the aggregate moisture condition and the ambient
temperature.
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Keywords
Roller types, Roller coverages, Roller patterns, Chip seal, MMLS3
Citation
Degree
PhD
Discipline
Civil Engineering