Process Development for an Ultra High Density Chip-on-Chip Power Module.

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dc.contributor.advisorDouglas Hopkins, Chairen_US
dc.contributor.advisorSubhashish Bhattacharya, Memberen_US
dc.contributor.advisorWensong Yu, Memberen_US
dc.contributor.authorYang, Mingyuen_US
dc.date.accepted2015-03-18en_US
dc.date.accessioned2015-03-26T09:30:10Z
dc.date.available2015-03-26T09:30:10Z
dc.date.defense2014-12-19en_US
dc.date.issued2014-12-19en_US
dc.date.released2015-03-26en_US
dc.date.reviewed2014-12-23en_US
dc.date.submitted2014-12-23en_US
dc.degree.disciplineElectrical Engineeringen_US
dc.degree.levelthesisen_US
dc.degree.nameMaster of Scienceen_US
dc.descriptionNorth Carolina State University Theses Electrical Engineering.
dc.formatM.S. North Carolina State University, 2015.
dc.identifier.otherdeg4029en_US
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.16/10118
dc.rightsen_US
dc.titleProcess Development for an Ultra High Density Chip-on-Chip Power Module.en_US
dcterms.extent1 online resource (x, 104 pages) : illustrations

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