A Low Order Thermal Envelope Model for Heat Transfer Characteristics of Low-rise Residential Buildings.

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dc.contributor.advisorRichard Gould, Chairen_US
dc.contributor.advisorAlexei Saveliev, Memberen_US
dc.contributor.advisorStephen Terry, Memberen_US
dc.contributor.authorAnand, Nadishen_US
dc.date.accepted2015-12-01en_US
dc.date.accessioned2015-12-04T10:01:35Z
dc.date.available2015-12-04T10:01:35Z
dc.date.defense2015-11-04en_US
dc.date.issued2015-11-04en_US
dc.date.released2015-12-04en_US
dc.date.reviewed2015-11-12en_US
dc.date.submitted2015-11-04en_US
dc.degree.disciplineMechanical Engineeringen_US
dc.degree.levelthesisen_US
dc.degree.nameMaster of Scienceen_US
dc.identifier.otherdeg4786en_US
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.16/10810
dc.rightsen_US
dc.titleA Low Order Thermal Envelope Model for Heat Transfer Characteristics of Low-rise Residential Buildings.en_US

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