Fixed-Abrasive Diamond Wire Saw Machining

Abstract

The goal of this research was to investigate the use of fixed abrasive diamond wire saw machining with wood and foam ceramic materials. Fixed abrasive diamond wire saw machining was developed in recent years to allow for thin kerf slicing of advanced semiconductor materials. The main advantages of this machining technology for the use in wood machining are its thin kerf loss and unidirectional cutting capability. The design of cutting experiments using a spooled wire saw is presented. The first experiment tested the response of machining wood repeatedly with the same process parameters. The next experiments tested the effect of changing wire axial speed and saw rocking motion conditions for pine and oak wood materials. Finally, an experiment was designed to machine three types of foam ceramic materials. A data acquisition system was constructed and signal-processing techniques for removing noise were developed. The data collection system was used to record forces and certain machine parameters during wire cutting. The machined surfaces for the wood materials were measured to determine their roughness. A Scanning Electron Microscope was used to examine new and used wire as well as cutting debris to study the effects of wire wear. Finally, the results and the direction of future work in this area are discussed.