Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
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2007
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Basceri, C., Visokay, M., Graettinger, T. M., & Cummings, S. D. (2007). Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers. U.S. Patent No. 7,253,102. Washington, DC: U.S. Patent and Trademark Office.