Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD

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dc.date.accessioned2008-10-14T16:20:09Z
dc.date.available2008-10-14T16:20:09Z
dc.date.issued1995
dc.format.extent170216 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.citationJoshi, R. V., Cuomo, J. J., Dalal, H. M., & Hsu, L. L. (1995). Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD. U.S. Patent No. 5,403,779. Washington, DC: U.S. Patent and Trademark Office.
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.2/1416
dc.language.isoen
dc.titleRefractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
dc.typePatent

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