Design, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits.

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dc.contributor.advisorPaul Franzon, Chairen_US
dc.contributor.advisorWinser Alexander, Memberen_US
dc.contributor.advisorWilliam Davis, Memberen_US
dc.contributor.advisorAmassa Fauntleroy, Memberen_US
dc.contributor.authorCharles, Garyen_US
dc.date.accepted2015-04-29en_US
dc.date.accessioned2015-05-01T09:30:23Z
dc.date.available2015-05-01T09:30:23Z
dc.date.defense2012-08-17en_US
dc.date.issued2012-08-17en_US
dc.date.released2015-05-01en_US
dc.date.reviewed2015-04-04en_US
dc.date.submitted2013-03-29en_US
dc.degree.disciplineElectrical Engineeringen_US
dc.degree.leveldissertationen_US
dc.degree.nameDoctor of Philosophyen_US
dc.identifier.otherdeg2540en_US
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.16/10302
dc.rightsen_US
dc.titleDesign, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits.en_US

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