Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
dc.date.accessioned | 2008-10-14T16:09:04Z | |
dc.date.available | 2008-10-14T16:09:04Z | |
dc.date.issued | 2001 | |
dc.format.extent | 182789 bytes | |
dc.format.mimetype | application/pdf | |
dc.identifier.citation | Joshi, R. V., Cuomo, J. J., Dalal, H. M., & Hsu, L. L. (2001). Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD. U.S. Patent No. 6,323,554. Washington, DC: U.S. Patent and Trademark Office. | |
dc.identifier.uri | http://www.lib.ncsu.edu/resolver/1840.2/1404 | |
dc.language.iso | en | |
dc.title | Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD | |
dc.type | Patent |