Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD

dc.date.accessioned2008-10-14T16:09:04Z
dc.date.available2008-10-14T16:09:04Z
dc.date.issued2001
dc.format.extent182789 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.citationJoshi, R. V., Cuomo, J. J., Dalal, H. M., & Hsu, L. L. (2001). Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD. U.S. Patent No. 6,323,554. Washington, DC: U.S. Patent and Trademark Office.
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.2/1404
dc.language.isoen
dc.titleRefractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
dc.typePatent

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