Packaging and Integration of Three Dimensional Microsensors.

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dc.contributor.advisorPaul Franzon, Chairen_US
dc.contributor.advisorMehmet Ozturk, Memberen_US
dc.contributor.advisorJon-Paul Maria, Memberen_US
dc.contributor.advisorMichael Steer, Memberen_US
dc.contributor.authorGadfort, Peteren_US
dc.date.accepted2014-01-10en_US
dc.date.accessioned2014-01-11T10:30:12Z
dc.date.available2014-01-11T10:30:12Z
dc.date.defense2013-12-16en_US
dc.date.issued2013-12-16en_US
dc.date.released2014-01-11en_US
dc.date.reviewed2013-12-19en_US
dc.date.submitted2013-12-16en_US
dc.degree.disciplineElectrical Engineeringen_US
dc.degree.leveldissertationen_US
dc.degree.nameDoctor of Philosophyen_US
dc.identifier.otherdeg3153en_US
dc.identifier.urihttp://www.lib.ncsu.edu/resolver/1840.16/9196
dc.rightsen_US
dc.titlePackaging and Integration of Three Dimensional Microsensors.en_US

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