Alignment of Silicon wafers for 3D Packaging
| dc.contributor.advisor | Hans D. Hallen, Committee Chair | en_US |
| dc.contributor.advisor | Michael Paesler, Committee Member | en_US |
| dc.contributor.advisor | Laura I. Clarke, Committee Member | en_US |
| dc.contributor.author | Walker, Ernest Marshall | en_US |
| dc.date.accessioned | 2010-04-02T17:54:58Z | |
| dc.date.available | 2010-04-02T17:54:58Z | |
| dc.date.issued | 2007-07-27 | en_US |
| dc.degree.discipline | Physics | en_US |
| dc.degree.level | thesis | en_US |
| dc.degree.name | MS | en_US |
| dc.description.abstract | Wafer level self-alignment is investigated with a Self assembled monolayer (SAM) deposition, SAM termination modification, friction dry and capillary alignment forces. SAMs are deposited on oxide layer, and characterized by ellipsometry and contact angle. Vinyl-terminated SAMs are oxidized to carboxyl-termination, which changes the wetting characteristics. Measurements for characterizing the layers are presented. The relative surface energies can also be estimated. From these characteristics it will be shown how surface energy is modified for the purpose of generating surface energy gradients in use with a self-alignment process. Self-alignment is observed using capillary forces, and exhibits a reasonable capture range. The self-alignment masks are used to increase this force and will be discussed. | en_US |
| dc.identifier.other | etd-06252006-142005 | en_US |
| dc.identifier.uri | http://www.lib.ncsu.edu/resolver/1840.16/373 | |
| dc.rights | I hereby certify that, if appropriate, I have obtained and attached hereto a written permission statement from the owner(s) of each third party copyrighted matter to be included in my thesis, dissertation, or project report, allowing distribution as specified below. I certify that the version I submitted is the same as that approved by my advisory committee. I hereby grant to NC State University or its agents the non-exclusive license to archive and make accessible, under the conditions specified below, my thesis, dissertation, or project report in whole or in part in all forms of media, now or hereafter known. I retain all other ownership rights to the copyright of the thesis, dissertation or project report. I also retain the right to use in future works (such as articles or books) all or part of this thesis, dissertation, or project report. | en_US |
| dc.subject | 3D packaging | en_US |
| dc.subject | capillary force | en_US |
| dc.subject | self alignment | en_US |
| dc.title | Alignment of Silicon wafers for 3D Packaging | en_US |
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