High performance integrated circuit chip package
| dc.date.accessioned | 2008-10-15T22:41:09Z | |
| dc.date.available | 2008-10-15T22:41:09Z | |
| dc.date.issued | 1994 | |
| dc.format.extent | 199780 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | Turlik, I., Reisman, A., Nayak, D., Hwang, L., Dishon, G., Jacobs, S., Darveaux, R., Poley, & Neil, M. (1994). High performance integrated circuit chip package. U.S. Patent No. 5,325,265. Washington, DC: U.S. Patent and Trademark Office. | |
| dc.identifier.uri | http://www.lib.ncsu.edu/resolver/1840.2/1591 | |
| dc.language.iso | en | |
| dc.title | High performance integrated circuit chip package | |
| dc.type | Patent |
