Design of Pipeline Fast Fourier Transform Processors using 3 Dimensional Integrated Circuit Technology
| dc.contributor.advisor | Prof. Xun Liu, Committee Member | en_US |
| dc.contributor.advisor | Prof. Paul Franzon, Committee Member | en_US |
| dc.contributor.advisor | Prof. William Rhett Davis, Committee Chair | en_US |
| dc.contributor.advisor | Prof. Steffen Heber, Committee Member | en_US |
| dc.contributor.author | Sule, Ambarish Mukund | en_US |
| dc.date.accessioned | 2010-04-02T18:39:23Z | |
| dc.date.available | 2010-04-02T18:39:23Z | |
| dc.date.issued | 2008-03-17 | en_US |
| dc.degree.discipline | Computer Engineering | en_US |
| dc.degree.level | dissertation | en_US |
| dc.degree.name | PhD | en_US |
| dc.description.abstract | Fast Fourier Transform (FFT) processing is an important component of many Digital Signal Processing (DSP) applications and communication systems. We focus on applications requiring large-point FFTs (>1024), and where high-speed of operation has priority. These range from Orthogonal Frequency Division Multiplexing (OFDM) based systems like Terrestrial Digital Video Broadcasting, very high speed digital subscriber loop systems and radar-based detection in military applications. We look at some of the popular FFT Architectures and compare their resource requirements and throughputs. We observe that the performance of pipelined large-point FFTs is limited due to the physical size and access times of the numerous First-in-First-out (FIFO) memories present in the design. For these pipeline FFTs, the critical path delay through arithmatic elements remains constant even as the number of stages increases, but the memory requirement almost doubles with every stage, thus increasing the memory access times in later stages. We demonstrate the advantage of using 3D Integrated Circuit Technology to assist in memory banks interleaving and stacking, leading to a boost in their performance. If the speed requirements for an application are less stringent, the same design could be tweaked and Vdd lowered to get a low power design. The 3DIC design methodology we use involves commercial single-tier CAD toolswith Perl, Python and TCL scripts to process their inputs and tie-up their single-tier outputs into a multi-tiered format. The design experiments utilize the 3-tier, 3-metal layer, fully depleted Silicon-on-Insulator 3D 0.18μm manufacturing process from MIT Lincoln Labs. Memory interleaving and stacking is demonstrated by the design of a 16KB FIFO which can run at 800Mhz. Finally, a design for an 8192-pt. FFT with 24 bits fixed-point inputs (12-bits each of real and imaginary) is proposed which uses the Radix-2⁄4⁄8 Multi-path Delay Commutator Pipelined Architecture and which can operate at 214 Mhz to give a new FFT set every 19μs. | en_US |
| dc.identifier.other | etd-01072008-144018 | en_US |
| dc.identifier.uri | http://www.lib.ncsu.edu/resolver/1840.16/3879 | |
| dc.rights | I hereby certify that, if appropriate, I have obtained and attached hereto a written permission statement from the owner(s) of each third party copyrighted matter to be included in my thesis, dis sertation, or project report, allowing distribution as specified below. I certify that the version I submitted is the same as that approved by my advisory committee. I hereby grant to NC State University or its agents the non-exclusive license to archive and make accessible, under the conditions specified below, my thesis, dissertation, or project report in whole or in part in all forms of media, now or hereafter known. I retain all other ownership rights to the copyright of the thesis, dissertation or project report. I also retain the right to use in future works (such as articles or books) all or part of this thesis, dissertation, or project report. | en_US |
| dc.subject | Fast Fourier Transform Processors | en_US |
| dc.subject | First-in First-out Memories | en_US |
| dc.subject | 3-Dimensional Integrated Circuits | en_US |
| dc.title | Design of Pipeline Fast Fourier Transform Processors using 3 Dimensional Integrated Circuit Technology | en_US |
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